Bonding apparatus and method

ABSTRACT

The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.

FIELD OF THE INVENTION

The present disclosure relates to methods for manufacturing absorbentarticles, and more particularly, to apparatuses and methods for bondingsubstrates that may be used as components of absorbent articles.

BACKGROUND OF THE INVENTION

Along an assembly line, various types of articles, such as for example,diapers and other absorbent articles, may be assembled by addingcomponents to and/or otherwise modifying an advancing, continuous web ofmaterial. For example, in some processes, advancing webs of material arecombined with other advancing webs of material. In other examples,individual components created from advancing webs of material arecombined with advancing webs of material, which in turn, are thencombined with other advancing webs of material. In some cases,individual components created from advancing web or webs are combinedwith other individual components created from other advancing web orwebs. Webs of material and component parts used to manufacture diapersmay include: backsheets, topsheets, leg cuffs, waist bands, absorbentcore components, front and/or back ears, fastening components, andvarious types of elastic webs and components such as leg elastics,barrier leg cuff elastics, stretch side panels, and waist elastics. Oncethe desired component parts are assembled, the advancing web(s) andcomponent parts are subjected to a final knife cut to separate theweb(s) into discrete diapers or other absorbent articles.

During the assembly process, various components and/or advancing webs ofmaterial may be bonded together in various ways. For example, in someprocesses, advancing webs and/or components may be bonded together withadhesives. In other processes, advancing webs and/or components may bemechanically bonded together with heat and pressure without the use ofadhesives. An example of such a mechanical bonding method and apparatusis disclosed in U.S. Pat. No. 4,854,984, wherein two laminae are bondedtogether by advancing through a nip between a patterned cylinder and ananvil cylinder. Pattern elements on the patterned cylinder exertpressure on the two laminae against the anvil roll to create discretebond sites. More particularly, bond sites are created as the extreme nippressure compresses and yields the laminae material in areas between thepattern elements and the anvil. During the bonding process, some of theyielded material may flow from the bond site to areas surrounding theperimeter of the pattern element.

However, extreme nip pressures may exceed the compressive yield strengthof cold work powder metal tool steels. In addition, current mechanicalbonding methods are susceptible to pattern element chipping, spalling,buckling, and/or otherwise fracturing, referred to generally as bondtool breakdown, sometimes necessitating frequent and costly repairs.These mechanical bonding methods may also damage the laminae by formingholes and/or tears in or around the bond sites. For example, patternelements may become deformed and/or fail after prolonged use due to highstresses that occur in the center portions of the pattern element duringthe bonding operation. In some instances, such high stresses may causecraters to form in the bonding surfaces of pattern elements. As apattern element degrades, the bonds created thereby may haveinconsistent aesthetic appearances; have relatively weaker strengths;and may tear or cut the bonded laminae in areas adjacent to the bonds.In addition, as the web basis weight of laminae decreases, bonds maybecome more susceptible to bond defects such as tearing and pinholes atrelatively high nip pressures.

Consequently, it would be beneficial to provide a method and apparatusfor mechanically bonding substrates that produces bond sites withrelatively low damage to the laminae and with reduced bond toolbreakdown.

SUMMARY OF THE INVENTION

The present disclosure relates to methods and apparatuses formechanically bonding substrates together. The apparatuses may include apattern roll including a pattern element protruding radially outward.The pattern element includes a pattern surface and includes one or morechannels adjacent the pattern surface. The pattern roll may bepositioned adjacent an anvil roll to define a nip between the patternsurface and the anvil roll, wherein the pattern roll is biased towardthe anvil roll to define a nip pressure between pattern surface and theanvil roll. As substrates advance between the pattern roll and anvilroll, the substrates are compressed between the anvil roll and thepattern surface to form a discrete bond region between the first andsecond substrates. As such, during the bonding process, some yieldedsubstrate material flows from under the pattern surface and into thechannel to form a channel grommet region.

In one embodiment, a method of bonding substrates comprises the stepsof: rotating an anvil roll; rotating a pattern roll adjacent the anvilroll, the pattern roll including a base circumferential surface, apattern element, wherein the pattern element includes a pattern surface,and wherein the pattern element protrudes outward from the basecircumferential surface to define a distance, Hp, between the patternsurface and the base circumferential surface, and wherein the patternelement is bounded by a perimeter, a channel in the pattern element, thechannel having a first end portion and a second end portion, the firstend portion located on the perimeter; advancing a first substrate and asecond substrate in a machine direction between the pattern roll and theanvil roll; and compressing the first substrate and the second substratebetween the anvil roll and the first and second pattern surfaces to forma discrete bond region between the first and second substrates.

In another embodiment, an apparatus for dynamically bonding substratescomprises: an anvil roll; a bonding roll including: base circumferentialsurface; a pattern element, wherein the pattern element includes apattern surface, and wherein the pattern element protrudes outward fromthe base circumferential surface to define a distance, Hp, between thepattern surface and the base surface, and wherein the pattern element isbounded by a perimeter; a channel in the pattern element, the channelhaving a first end portion and a second end portion, the first endportion located on the perimeter; and wherein the bonding roll isadjacent the anvil roll to define a nip between the pattern surface andthe anvil roll; and wherein the bonding roll is biased toward the anvilroll to define a nip pressure from about 40,000 PSI to about 60,000 PSIbetween the pattern surface and the anvil roll.

In yet another embodiment, a laminate comprises: a first substrate; asecond substrate; a discrete bond between the first substrate and thesecond substrate, the discrete bond including a first region having afirst basis weight, a second region having a second basis weight, and athird region having a third basis weight, wherein third basis weight isgreater than the first basis weight, and wherein the second basis weightis greater than first basis weight; and wherein the second regiondefines a perimeter of the discrete bond, the perimeter surrounding acentral region of the discrete bond; and wherein the first region andthe third region are located in the central region.

In still another embodiment, a laminate comprises: a first substrate; asecond substrate; a discrete bond between the first substrate and thesecond substrate, the discrete bond including a first region having afirst basis weight, a second region having a second basis weight, and athird region having a third basis weight, wherein a ratio of the secondbasis weight to the first basis weight is greater than one; and whereina ratio of the third basis weight to the first basis weight is greaterthan one; and wherein the second region defines a perimeter of thediscrete bond, the perimeter surrounding a central region of thediscrete bond; and wherein the first region and the second region arelocated in the central region.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side view of a bonding apparatus.

FIG. 2 is a detailed view of the bonding apparatus of FIG. 1.

FIG. 3 is a perspective view a pattern roll.

FIG. 4 is a detailed isometric view of a pattern element.

FIG. 5 is a top side view of the pattern element of FIG. 4.

FIG. 5A is a top side view of an embodiment of a pattern element havinga single channel.

FIG. 5B is a top side view of an embodiment of a pattern element havingtwo channels that do not intersect.

FIG. 5C is a top side view of an embodiment of a pattern element havingfour channels that do not intersect and wherein each channel has onlyone end portion on the perimeter of the pattern element.

FIG. 6 is a cross-sectional view of the pattern element of FIG. 5 takenalong line 6-6.

FIG. 7 is a cross-sectional view of the pattern element of FIG. 5 takenalong line 7-7.

FIG. 8 is a detailed side view along the machine direction MD of thepattern element of FIG. 5 bonding a first substrate with a secondsubstrate.

FIG. 9 is a detailed side view along the cross direction CD of thepattern element of FIG. 5 bonding a first substrate with a secondsubstrate.

FIG. 10 is a top side view of a perspective view of a discrete bondregion.

FIG. 11 is a cross-sectional view of the bond region of FIG. 10 takenalong line 11-11.

FIG. 12 is a cross-sectional view of the bond region of FIG. 10 takenalong line 12-12.

FIG. 13 is a perspective view of a diaper pant.

FIG. 14A is a partially cut away plan view of the diaper pant shown inFIG. 13.

FIG. 14B is a partially cut away plan view of a second embodiment of adiaper pant.

FIG. 15A is a cross-sectional view of the diaper pants of FIGS. 14A and4B taken along line 15A-15A.

FIG. 15B is a cross-sectional view of the diaper pants of FIGS. 14A and14B taken along line 15B-15B.

FIG. 16 is a schematic side view of a converting apparatus adapted tomanufacture pre-fastened, pant diapers.

FIG. 17A is a view of a continuous length of chassis assemblies fromFIG. 16 taken along line A-A.

FIG. 17B1 is a view of a discrete chassis from FIG. 16 taken along lineB1-B1.

FIG. 17B2 is a view of a discrete chassis from FIG. 16 taken along lineB2-B2.

FIG. 17C is a view of continuous lengths of advancing front and backside panel material from FIG. 16 taken along line C-C.

FIG. 17D is a view of multiple discrete chassis spaced from each otheralong the machine direction MD and connected with each other by thefront and back side panel material from FIG. 16 taken along line D-D.

FIG. 17E is a view of folded multiple discrete chassis with the frontand back side panel material in a facing relationship from FIG. 16 takenalong line E-E.

FIG. 17F is a view of two discrete absorbent articles advancing themachine direction MD from FIG. 16 taken along line F-F.

FIG. 18 is a graphical representation illustrating strengths of discretebonds created by pattern elements with channels and pattern elementswithout channels over a range of pattern surface pressures.

FIG. 19A illustrates the pattern element orientation of the Channel Nubson a pattern roll in the machine direction MD and cross direction CD.

FIG. 19B illustrates the pattern element orientation of the Control Nubson a pattern roll in the machine direction MD and cross direction CD.

FIG. 20 illustrates an example test sample for use with the peelstrength test method.

DETAILED DESCRIPTION OF THE INVENTION

The following term explanations may be useful in understanding thepresent disclosure:

“Absorbent article” is used herein to refer to consumer products whoseprimary function is to absorb and retain soils and wastes. “Diaper” isused herein to refer to an absorbent article generally worn by infantsand incontinent persons about the lower torso. The term “disposable” isused herein to describe absorbent articles which generally are notintended to be laundered or otherwise restored or reused as an absorbentarticle (e.g., they are intended to be discarded after a single use andmay also be configured to be recycled, composted or otherwise disposedof in an environmentally compatible manner).

An “elastic,” “elastomer” or “elastomeric” refers to materialsexhibiting elastic properties, which include any material that uponapplication of a force to its relaxed, initial length can stretch orelongate to an elongated length more than 10% greater than its initiallength and will substantially recover back to about its initial lengthupon release of the applied force.

As used herein, the term “joined” encompasses configurations whereby anelement is directly secured to another element by affixing the elementdirectly to the other element, and configurations whereby an element isindirectly secured to another element by affixing the element tointermediate member(s) which in turn are affixed to the other element.

“Longitudinal” means a direction running substantially perpendicularfrom a waist edge to a longitudinally opposing waist edge of anabsorbent article when the article is in a flat out, uncontracted state,or from a waist edge to the bottom of the crotch, i.e. the fold line, ina bi-folded article. Directions within 45 degrees of the longitudinaldirection are considered to be “longitudinal.” “Lateral” refers to adirection running from a longitudinally extending side edge to alaterally opposing longitudinally extending side edge of an article andgenerally at a right angle to the longitudinal direction. Directionswithin 45 degrees of the lateral direction are considered to be“lateral.”

The term “substrate” is used herein to describe a material which isprimarily two-dimensional (i.e. in an XY plane) and whose thickness (ina Z direction) is relatively small (i.e. 1/10 or less) in comparison toits length (in an X direction) and width (in a Y direction).Non-limiting examples of substrates include a web, layer or layers orfibrous materials, nonwovens, films and foils such as polymeric films ormetallic foils. These materials may be used alone or may comprise two ormore layers laminated together. As such, a web is a substrate.

The term “nonwoven” refers herein to a material made from continuous(long) filaments (fibers) and/or discontinuous (short) filaments(fibers) by processes such as spunbonding, meltblowing, carding, and thelike. Nonwovens do not have a woven or knitted filament pattern.

The term “machine direction” (MD) is used herein to refer to thedirection of material flow through a process. In addition, relativeplacement and movement of material can be described as flowing in themachine direction through a process from upstream in the process todownstream in the process.

The term “cross direction” (CD) is used herein to refer to a directionthat is generally perpendicular to the machine direction.

The term “yield” is used herein to refer to permanent and non-reversiblematerial displacement due to subjecting the material to mechanicalstress past the yield stress of the material and/or permanent andnon-reversible material displacement due to subjecting the material totemperatures higher than the melting point of the material.

The term “pant” (also referred to as “training pant”, “pre-closeddiaper”, “diaper pant”, “pant diaper”, and “pull-on diaper”) refersherein to disposable absorbent articles having a continuous perimeterwaist opening and continuous perimeter leg openings designed for infantor adult wearers. A pant can be configured with a continuous or closedwaist opening and at least one continuous, closed, leg opening prior tothe article being applied to the wearer.

The present disclosure relates to methods and apparatuses formanufacturing absorbent articles, and in particular, to methods andapparatuses for mechanically bonding substrates together. Theapparatuses may include a pattern roll and an anvil roll. The patternroll may include a pattern element protruding radially outward, whereinthe pattern element includes a pattern surface. And the pattern roll maybe adjacent the anvil roll to define a nip between the pattern surfaceand the anvil roll, wherein the pattern roll is biased toward the anvilroll to define a nip pressure between pattern surface and the anvilroll. As the first and second substrates advance between the patternroll and anvil roll, the first substrate and the second substrate arecompressed between the anvil roll and the pattern surface to form adiscrete bond region between the first and second substrates. Moreparticularly, during the bonding process, heat generated by the nippressure causes the first and second substrate material to yield. Andthe yielded material is pressed together to form a bond region. Inaddition, some of the yielded material flows outward from under thepattern surface to form a perimeter grommet region along the outerperimeter of the pattern element. As discussed in more detail below, thepattern element also includes one or more recessed areas, referred toherein as channels, grooves, or conduits, adjacent the pattern surface.As such, during the bonding process, some of the yielded material alsoflows from under the pattern surface and into the channel to form achannel grommet region.

It is to be appreciated that various arrangements and configurations ofthe apparatuses and methods herein may be used to bond various types ofsubstrates together. For example, as discussed in more detail below,apparatuses and methods according to the present disclosure may beutilized to bond various substrates together during the production ofvarious components of absorbent articles, such as diapers.

FIG. 1 shows an embodiment of a bonding apparatus 100 that may be usedto bond a first substrate 102 and a second substrate 104 together toform a laminate 105. As shown in FIG. 1, the bonding apparatus 100 mayinclude a bonding roll 106, also referred to herein as a pattern roll106, adapted to rotate around an axis of rotation 108, and an anvil roll110 adapted to rotate around an axis of rotation 112. The anvil roll 110includes an outer circumferential surface 114. And as shown in FIGS.1-4, the pattern roll 106 may include one or more pattern elements 116,each pattern element 116 including a pattern surface 118. Withparticular reference to FIG. 4, the pattern roll 106 may include a basecircumferential surface 120, wherein each pattern element 116 includes acircumferential wall 122 that protrudes radially outward from the basecircumferential surface 120 to define a distance, Hp, between thepattern surface 118 and the base surface 120. The circumferential wall122 also defines an outer perimeter 124 of the pattern element 116. Itis to be appreciated that in some embodiments, the circumferential wall122 may be perpendicular to base circumferential surface 120 or maysloped or tapered with respect to the base circumferential surface 120.As shown in FIGS. 1 and 2, the pattern roll 106 is adjacent the anvilroll 110 so as to define a nip 126 between the pattern roll 106 and theanvil roll 110, and more particularly, to define a nip 126 between thepattern surface 118 of each pattern element 116 and the anvil roll 110.As discussed in more detail below, the pattern roll 106 may be biasedtoward the anvil roll 110 to define a nip pressure between the patternsurface 118 and the anvil roll 106. It is to be appreciated that theanvil roll 110 may also be biased toward the pattern roll 106, and/orthe pattern and anvil rolls may be biased toward each other to definethe nip pressure between the pattern surface 118 and the anvil roll 110.It is to be appreciated that the pattern roll 106 and the anvil roll 110may be configured to rotate such that the pattern surfaces 118 on thepattern roll 106 and the outer circumferential surface 114 of the anvilroll 110 move at the same speeds or different speeds. It is to beappreciated that the bonding methods and apparatuses herein can beconfigured to bond substrates together that are advancing at variousspeeds, such as for example, speeds of about 240 feet or more perminute.

As shown in FIGS. 1 and 2, during the bonding operation, the patternroll 106 may rotate in a first direction 128 around the axis of rotation108 of the pattern roll 106, and the anvil roll 110 may rotate in asecond direction 130, opposite the first direction 128, around the axisof rotation 112 of the anvil roll 110. The first substrate 102 andsecond substrate 104 may advance in a machine direction MD between thepattern roll 106 and the anvil roll 110. More particularly, the firstsubstrate 102 includes a first surface 132 and a second surface 134opposite the first surface 132, and the second substrate 104 includes afirst surface 136 and a second surface 138 opposite the first surface136. As such, the first surface 132 of the first substrate 102 iscontacted by the pattern roll 106, and the second surface 138 of thesecond substrate 104 is contacted by the anvil roll 110. And the secondsurface 134 of the first substrate 102 and the first surface 136 of thesecond substrate 104 contact each other. As first substrate 102 andsecond substrate 104 advance through the nip 126 between the patternsurface 118 of a pattern element 116 and the anvil roll 110, the patternelement 116 contacts the first substrate 102 and compresses the firstsubstrate 102 and second substrate 104 between the pattern surface 118of the pattern element 116 and the anvil roll 110. In turn, heatgenerated by the nip pressure causes the first and second substratematerial to yield. And, as described below with reference to FIGS. 8 and9, the pattern surface 118 presses yielded material 140 of the first andsecond substrates 102, 104 together to form a discrete bond region 142between the first and second substrates 102, 104. Thus, the apparatus100 may form a laminate 105 including first and second substrates 102,104 bonded together by discrete bond regions 142, without the use ofadhesives. It is to be appreciated, however, that the bonding apparatus100 may also be used in combination with adhesives. Although FIG. 1shows the apparatus 100 bonding two substrates together, it is to beappreciated that the apparatus may bond more than two substratestogether. In addition, it is to be appreciated that the apparatus mayalso be used to bond fibers of nonwoven together on a single substrateand/or emboss a pattern on a single substrate. It should also beappreciated that the pattern elements 116 may be configured with thesame or different distances, Hp, between the pattern surface 118 and thebase surface 120. Embodiments that are configured with differentdistances, Hp, may utilize bearer ring configurations such as describedin European Patent Publication No. EP1635750B1. In addition, thedistance, Hp, may be greater than the sum of the thicknesses of thesubstrates 102, 104 being bonded.

It is to be appreciated that various pattern element configurations maybe used with the bonding apparatuses and processes herein. For example,FIGS. 4-7 show an embodiment of a pattern element 116 including channels144 extending through the pattern surface 118. The channels 144 in thepattern element provide a location, in addition to regions outside ofand adjacent to the perimeter 124 of the pattern element 116, foryielded substrate material 140 to flow during the bonding process.Allowing yielded substrate material 140 to flow to the channels 144during the bonding process may help provide stress relief on the patternelement 116, which may in turn, help reduce the frequency of patternelement deformations, including buckling, and/or failures and may helpprovide for more relatively more consistent and stronger bonds.

With continued reference back to FIGS. 4-7, the pattern element 116 mayinclude a first channel 144 a and a second channel 144 b that extendinto the pattern element 116 to define a maximum depth, D, between thepattern surface 118 and bottom surfaces 146 of the channels 144 a, 144b. It is to be appreciated that the channels 144 a, 144 b may eachdefine the same depth, may define different depths, and may definevarying depths. The first and second channels 144 a, 144 b also extendthrough the pattern surface 118 and cross each other. In particular, thefirst channel 144 a includes a first end portion 148 and a second endportion 150, each end portion 148, 150 extending through perimeter 124of the pattern element 116. And the second channel 144 b includes afirst end portion 152 and a second end portion 154, each end portion152, 154 extending though perimeter 124 of the pattern element 116. Thefirst and second channels 144 a, 144 b cross each other in a centralportion 156 of the pattern element 116. As such, the first channel 144a, the second channel 144 b, and circumferential wall 122 of the patternelement 116 divide the pattern surface 118 of the pattern element 116into four discrete pattern surfaces 118 a, 118 b, 118 c, 118 d.

It is to be appreciated that the apparatus 100 may be configured withvarious different configurations of pattern elements 116. For example,the pattern roll may be configured with pattern elements havingdifferent sizes and shapes. For example, in some embodiments, thepattern elements may have a perimeter that defines circular, square,rectangular, and various types of other shapes. For example, the patternelements may have a perimeter that defines an elliptical shape, such asshown in FIG. 5. As such, in some embodiments, an elliptical shapepattern element may have a major axis of about 0.2 mm to about 20 mm. Insome embodiments, the pattern elements may have pattern surfaces thatdefine areas of about 0.04 mm² to about 400 mm². The pattern element mayalso include channels of various sizes. In some embodiments, the widthof the channels at the pattern surface may by about 0.05 mm to about 1mm. In some embodiments, the channels may define maximum depth, D, ofabout 0.05 mm to about 10 mm. In some embodiments, the channels maydefine a maximum depth, D, and a width of about 0.15 mm. In someembodiments, the channels may define maximum depths, D, from about 5% to95% of the distance, Hp, between the pattern surface 118 and the basesurface 120. In addition, the pattern elements may include variousquantities of the same or differently configured channels. For example,in some embodiments, the pattern elements 116 include a single channel144, such as shown for example in FIG. 5A. In some embodiments, thepattern elements 116 include two or more channels 144 that may or maynot intersect each other. For example, FIG. 5B shows an embodiment of apattern element 116 having two channels 144 that do not intersect eachother. In another example, FIG. 5C shows an embodiment of a patternelement 116 having four channels 144 that do not intersect and whereineach channel 144 has only one end portion 147 on the perimeter 124 ofthe pattern element 116. In addition, the bottom surfaces of channelsmay define various different cross sectional shapes of the channels,such as for example, curved, rectangular, and square. In some instances,the pattern elements may be configured such that resulting bond regionsalso offer aesthetic benefits such as, for example, a stitched likeappearance along with a relatively smooth texture feel to the skin.

Although the bonding apparatus 100 depicted herein includes an anvilroll 110 that may have a smooth outer circumferential surface 114 and apattern roll 106 including pattern elements 116 having channels 114 inthe pattern surfaces 118, it is to be appreciated other apparatusconfigurations are contemplated herein. For example, in someembodiments, the anvil roll 110 may have channels 144 in the outercircumferential surface 114. In other embodiments, the outercircumferential surface 114 of the anvil roll 110 and the patternelements 116 on the pattern roll 106 may both include channels 114. Inyet other embodiments, instead of having an anvil roll, the apparatusmay be configured with a first pattern roll and a second pattern roll,each having pattern elements, wherein some or all the pattern elementsmay include channels.

As discussed above, during the bonding process, the first and secondsubstrates 102, 104 advance in the machine direction MD between therotating pattern roll 106 and the anvil roll 110. As the pattern roll106 and the anvil rotate 110, the pattern surfaces 118 of the patternelements 116 contact the first substrate 106 and compress the first andsecond substrates 102, 104 in the nip 126 between the pattern surface118 and the outer circumferential surface 114 of the anvil roll 112. Nippressure between the pattern surface 118 of the pattern element 116 andthe anvil roll 110 exerted on the first and second substrates 102, 104causes some material 140 of the first and second substrates 102, 104 toyield. As shown in FIGS. 8 and 9, some of the yielded material 140between the pattern surfaces 118 a, 118 b, 118 c, 118 d and the anvilroll 110 is fused together in first locations 158 between the patternsurfaces 118 a, 118 b, 118 c, 118 d and the anvil roll 110. In addition,some of the yielded material 140 flows out from between the patternsurfaces 118 a, 118 b, 118 c, 118 d and the anvil roll 110 to secondlocations 160 along the perimeter 124 of the pattern element 116. Andsome of the yielded material 140 flows out from between the patternsurfaces 118 a, 118 b, 118 c, 118 d and the anvil roll 110 to thirdlocations 162 along the channels 144 a, 144 b. As discussed in moredetail below, the yielded material 140 in the first locations 158,second locations 160, and third locations 162 fuses together to form adiscrete bond 142 between the first substrate 102 and the secondsubstrate 104.

FIGS. 10-12 show an example bond 142 between the first and secondsubstrates 102, 104 that may be created by the apparatus 100. As shownin FIG. 10, the bond 142 includes first regions 164 that correspond withthe first locations 158 wherein some of the yielded material 140 betweenthe pattern surfaces 118 and the anvil roll 110 is fused togetherbetween the pattern surfaces 118 and the anvil roll 110. In particular,the bond 142 may include four first regions 164 a, 164 b, 164 c, 164 dthat correspond with the pattern surfaces 118 a, 118 b, 118 c, 118 d,respectively. The bond 142 also includes second regions 166 thatcorrespond with the second locations 160 where some of the yieldedmaterial 140 that flowed out from between the pattern surfaces 118 andthe anvil roll 110 to areas along the perimeter 124 of the patternelement 116 is fused together. The second regions 166 may also bereferred to herein as perimeter grommet regions. In addition, the bond142 includes third regions 168 that correspond with the third locations162 where some of the yielded material 140 that flowed out from betweenthe pattern surfaces 118 and the anvil roll 110 to areas along thechannels 144 of the pattern element 116 is fused together. The thirdregions 168 may also be referred to herein as channel grommet regions.In particular, the bond 142 may include two third regions 168 a, 168 bthat correspond with the first and second channels 144 a, 144 b,respectively. As such, the second region 166 defines a perimeter of thediscrete bond 142, the perimeter surrounding a central region of thediscrete bond 142 wherein the first region 164 and the third region 168are located in the central region.

As previously mentioned, the channels 144 in the pattern element providea location, in addition to regions outside of and adjacent to theperimeter 124 of the pattern element 116, for yielded substrate material140 to flow and form channel and perimeter grommet regions during thebonding process. In contrast, when bonding substrates with patternelements having no channels, yielded substrate material may be requiredto flow relatively longer distances to form perimeter grommet regionsoutside of and adjacent the perimeter of the pattern element. Statedanother way, when bonding substrates with pattern elements havingchannels, yielded substrate material may be required to flow relativelyshorter distances to form channel grommet and perimeter grommet regions.The relatively shorter flow distances of yielded material may also helpreduce hydraulic-like reactionary pressures in the nip. Further, someair may be entrained in laminae during formation, and collapse of theair bubbles, known as cavitation, would be significantly reduced byshortening the flow distance path needed for grommet formation.

It is also to be appreciated that pattern elements 116 with channels,such as shown in FIG. 4-7, may create discrete bonds 142 havingsubstantially the same bond strengths as discrete bonds created bypattern elements of the same size and having no channels with reducednip pressures. For example, FIG. 18 provides a graph illustratingstrengths of discrete bonds created by pattern elements with channelsand pattern elements without channels over a range of nip pressuresbetween the pattern surfaces and the anvil roll. In generating the datarepresented in FIG. 18, a 15 gsm SMS spunbonded-meltblown-spunbondedpolypropylene nonwoven substrate was bonded to a 12 gsm polypropylenespunbonded nonwoven substrate with oval shaped pattern elements 116having crossing channels 144 (such as shown in FIG. 19A) in the patternsurface (Channel Nubs 116 a). In addition, a 15 gsm polypropylenenonwoven substrate was bonded to a 12 gsm polypropylene nonwovensubstrate with oval shaped pattern elements without channels in thepattern surface (Control Nubs 117). FIG. 19A illustrates the patternelement orientation of the Channel Nubs 116 a on a pattern roll 106 inthe machine direction MD and cross direction CD. And FIG. 19Billustrates the pattern element orientation of the Control Nubs 117 on apattern roll 106 in the machine direction MD and cross direction CD.

TABLE 1 MD Distance CD Distance between Between Pattern Major MinorPattern Pattern Channel Channel Element Axis Axis Surfaces SurfacesWidth Depth Channel 2.18 mm 1.40 mm 3.54 mm 1.82 mm 0.15 mm 0.15 mm NubControl 2.18 mm 1.40 mm 3.54 mm 1.82 mm n.a. n.a. Nub

Table 1 above provides additional dimensional information about theoval-shaped Channel Nubs 116 a and Control Nubs 117 used to generate thedata illustrated in FIG. 18. The nonwoven substrates were bonded to eachother with the Channel Nubs 116 a and Control Nubs 117 at various nippressures between the pattern surfaces 118 and an anvil roll. TheAverage Peak Bond Strengths of the bonds generated at the various nippressures were then measured according to the Peel Strength Test Methodherein.

It is to be appreciated that bonds 142 formed with the methods andapparatuses herein may have regions of varying thicknesses or calipers.As shown in FIGS. 10-12, the discrete bond 142 includes a first surface170 opposite a second surface 172. A such, the bond may have: a firstthickness, C₁; between the first surface 170 and the second surface 172in the first region 164; a second thickness, C₂; between the firstsurface 170 and the second surface 172 in the second region 166; andthird thickness, C₃; between the first surface 170 and the secondsurface 172 in the third region 168. In some embodiments, the secondthickness, C₂, and the third thickness, C₃, may both be greater than thefirst thickness, C₁, and in some embodiments, the second thickness, C₂,may also be greater than the third thickness, C₃. In other embodiments,the second thickness, C₂, may be the same as or less than the thirdthickness, C₃. It is also to be appreciated that bonds 142 formed withthe methods and apparatuses herein may have varying regions of differentbasis weights. For example, with continued reference to FIGS. 10-12, thefirst region 164 may have a first basis weight, BW₁; the second region166 may have a second basis weight, BW₂; and the third region 168 mayhave a third basis weight, BW₃. In some embodiments, the second basisweight, BW₂, and the third basis weight, BW₃, may both be greater thanthe first basis weight, BW₁, and in some embodiments, the second basisweight, BW₂, may also be greater than the third basis weight, BW₃. Inother embodiments, the second basis weight, BW₂, may be the same as orless than the third basis weight, BW₃.

It is also to be appreciated that bonds 142 formed with the methods andapparatuses herein may have varying regions of different opacities. Forexample, the first region 164 may define a first opacity; the secondregion 166 may define a second opacity; and the third region 168 maydefine a third opacity. In some embodiments, the second and thirdopacities are greater than the first opacity.

It is to be appreciated that bonds having various differentcharacteristics may be formed with the apparatuses and methods herein.For example, in some embodiments wherein the bond 142 is formed bycompressing two substrates between the pattern surface 118 and arelatively smooth outer circumferential surface 114 of an anvil 110, thefirst, second, and third regions of the bond may protrude from therespective surfaces 170, 172 by different distances. For example, asshown in FIGS. 11 and 12, the second region 166 defines a first maximumprotrusion height, PH_(1A), with respect to the first surface 170 anddefines a second maximum protrusion height, PH_(2A), with respect to thesecond surface 172. In some embodiments, the first maximum protrusionheight, PH_(1A), is greater than the second maximum protrusion height,PH_(2A). In addition, the bond may be configured such that the thirdregion 168 defines a first maximum protrusion height, PH_(1B), withrespect to the first surface 170 and defines a second maximum protrusionheight, PH_(2B), with respect to the second surface 172. In someembodiments, the first maximum protrusion height, PH_(1B), is greaterthan the second maximum protrusion height, PH_(2B). When using thebonding apparatuses and methods herein to make absorbent articles, suchas diapers for example, the bonds may be positioned on the article suchthat the bond surfaces having relatively higher protrusion heights faceaway from the wearer of the article.

It is to be appreciated that the bonding apparatus 100 may also beconfigured in various different ways. For example, different types ofmotor arrangements may be used to rotate the pattern roll 106 and anvilroll 110. For example, the pattern roll 106 and the anvil roll 110 maybe driven independently with two independent motors. In addition, thenip pressure between pattern surface and the anvil roll may be generatedin various ways. For example, as previously mentioned, the pattern rollmay be biased toward anvil roll; the anvil roll may be biased toward thepattern roll; or the pattern and anvil rolls may be biased toward eachother. The biasing of the rolls may be accomplished in various ways,such as described for example in U.S. Pat. No. 4,854,984. In someembodiments, the bonding apparatus 100 is configured to define a nippressure above 60,000 PSI between the pattern surface 118 and the anvilroll 110. In some embodiments, the bonding apparatus 100 is configuredto define a nip pressure from about 40,000 PSI to about 60,000 PSIbetween the pattern surface 118 and the anvil roll 110. In someembodiments, the bonding apparatus 100 is configured to define a nippressure of about 40,000 PSI between the pattern surface 118 and theanvil roll 110. In some embodiments, the bonding apparatus 100 isconfigured to define a nip pressure of about 50,000 PSI between thepattern surface 118 and the anvil roll 110. In some embodiments, thebonding apparatus 100 is configured to define a nip pressure of about60,000 PSI between the pattern surface 118 and the anvil roll 110. It isalso to be appreciated that the pattern roll and/or the anvil roll maybe heated.

It is to be appreciated that the apparatuses and methods herein can beused to bond various types of substrates together. For example, in someembodiments the apparatus may used to bond nonwoven substrates, such asfor example, polypropylene nonwoven, polyethylene film, bi-componentnonwoven or film, polyethylene terephthalate nonwoven or film. In someembodiments, the apparatuses and methods herein may be used to bond asubstrate which includes a mixture of cellulosic fibers and polyethyleneor polyethylene-polypropylene bicomponent fibers or particulate. In someembodiments, the substrates may have a basis weight of about 6 gsm toabout 100 gsm. Other types of substrates can be sandwiched in betweentwo layers of nonwovens or films.

As previously mentioned, the bonding apparatuses and methods herein mayused to bond various types of components used in the manufacture ofdifferent types of absorbent articles. To help provide additionalcontext to the previous discussion of the process and apparatusembodiments, the following provides a general description of absorbentarticles in the form of diapers that include components may be bondedwith the methods and apparatuses disclosed herein.

For the purposes of a specific illustration, FIGS. 13 and 14A show anexample of a diaper pant 300 that may be assembled in accordance withthe apparatuses and methods disclosed herein. In particular, FIG. 13shows a perspective view of a diaper pant 300 in a pre-fastenedconfiguration, and FIG. 14A shows a plan view of the diaper pant 300with the portion of the diaper that faces away from a wearer orientedtoward the viewer. The diaper pant 300 shown in FIGS. 13 and 14Aincludes a chassis 302 and a ring-like elastic belt 304. As discussedbelow in more detail, a first elastic belt 306 and a second elastic belt308 are connected together to form the ring-like elastic belt 304.

With continued reference to FIG. 14A, the chassis 302 includes a firstwaist region 316, a second waist region 318, and a crotch region 320disposed intermediate the first and second waist regions. The firstwaist region 316 may be configured as a front waist region, and thesecond waist region 318 may be configured as back waist region. In someembodiments, the length of each of the front waist region, back waistregion, and crotch region may be ⅓ of the length of the absorbentarticle 300. The diaper 300 may also include a laterally extending frontwaist edge 321 in the front waist region 316 and a longitudinallyopposing and laterally extending back waist edge 322 in the back waistregion 318. To provide a frame of reference for the present discussion,the diaper 300 and chassis 302 of FIG. 14A are shown with a longitudinalaxis 324 and a lateral axis 326. In some embodiments, the longitudinalaxis 324 may extend through the front waist edge 321 and through theback waist edge 322. And the lateral axis 326 may extend through a firstlongitudinal or right side edge 328 and through a midpoint of a secondlongitudinal or left side edge 330 of the chassis 302.

As shown in FIGS. 13 and 14A, the diaper pant 300 may include an inner,body facing surface 332, and an outer, garment facing surface 334. Thechassis 302 may include a backsheet 336 and a topsheet 338. The chassis302 may also include an absorbent assembly 340, including an absorbentcore 342, disposed between a portion of the topsheet 338 and thebacksheet 336. As discussed in more detail below, the diaper 300 mayalso include other features, such as leg elastics and/or leg cuffs toenhance the fit around the legs of the wearer.

As shown in FIG. 14A, the periphery of the chassis 302 may be defined bythe first longitudinal side edge 328, a second longitudinal side edge330, a first laterally extending end edge 344 disposed in the firstwaist region 316, and a second laterally extending end edge 346 disposedin the second waist region 318. Both side edges 328 and 330 extendlongitudinally between the first end edge 344 and the second end edge346. As shown in FIG. 14A, the laterally extending end edges 344 and 346are located longitudinally inward from the laterally extending frontwaist edge 321 in the front waist region 316 and the laterally extendingback waist edge 322 in the back waist region 318. When the diaper pant300 is worn on the lower torso of a wearer, the front waist edge 321 andthe back waist edge 322 of the chassis 302 may encircle a portion of thewaist of the wearer. At the same time, the chassis side edges 328 and330 may encircle at least a portion of the legs of the wearer. And thecrotch region 320 may be generally positioned between the legs of thewearer with the absorbent core 342 extending from the front waist region316 through the crotch region 320 to the back waist region 318.

It is to also be appreciated that a portion or the whole of the diaper300 may also be made laterally extensible. The additional extensibilitymay help allow the diaper 300 to conform to the body of a wearer duringmovement by the wearer. The additional extensibility may also help, forexample, the user of the diaper 300, including a chassis 302 having aparticular size before extension, to extend the front waist region 316,the back waist region 318, or both waist regions of the diaper 300and/or chassis 302 to provide additional body coverage for wearers ofdiffering size, i.e., to tailor the diaper to an individual wearer. Suchextension of the waist region or regions may give the absorbent articlea generally hourglass shape, so long as the crotch region is extended toa relatively lesser degree than the waist region or regions, and mayimpart a tailored appearance to the article when it is worn.

As previously mentioned, the diaper pant 300 may include a backsheet336. The backsheet 336 may also define the outer surface 334 of thechassis 302. The backsheet 336 may be impervious to fluids (e.g.,menses, urine, and/or runny feces) and may be manufactured from a thinplastic film, although other flexible liquid impervious materials mayalso be used. The backsheet 336 may prevent the exudates absorbed andcontained in the absorbent core from wetting articles which contact thediaper 300, such as bedsheets, pajamas and undergarments. The backsheet336 may also comprise a woven or nonwoven material, polymeric films suchas thermoplastic films of polyethylene or polypropylene, and/or amulti-layer or composite materials comprising a film and a nonwovenmaterial (e.g., having an inner film layer and an outer nonwoven layer).The backsheet may also comprise an elastomeric film. An examplebacksheet 336 may be a polyethylene film having a thickness of fromabout 0.012 mm (0.5 mils) to about 0.051 mm (2.0 mils). Exemplarypolyethylene films are manufactured by Clopay Corporation of Cincinnati,Ohio, under the designation BR-120 and BR-121 and by Tredegar FilmProducts of Terre Haute, Ind., under the designation XP-39385. Thebacksheet 336 may also be embossed and/or matte-finished to provide amore clothlike appearance. Further, the backsheet 336 may permit vaporsto escape from the absorbent core (i.e., the backsheet is breathable)while still preventing exudates from passing through the backsheet 336.The size of the backsheet 336 may be dictated by the size of theabsorbent core 342 and/or particular configuration or size of the diaper300.

Also described above, the diaper pant 300 may include a topsheet 338.The topsheet 338 may also define all or part of the inner surface 332 ofthe chassis 302. The topsheet 338 may be compliant, soft feeling, andnon-irritating to the wearer's skin. It may be elastically stretchablein one or two directions. Further, the topsheet 338 may be liquidpervious, permitting liquids (e.g., menses, urine, and/or runny feces)to penetrate through its thickness. A topsheet 338 may be manufacturedfrom a wide range of materials such as woven and nonwoven materials;apertured or hydroformed thermoplastic films; apertured nonwovens,porous foams; reticulated foams; reticulated thermoplastic films; andthermoplastic scrims. Woven and nonwoven materials may comprise naturalfibers such as wood or cotton fibers; synthetic fibers such aspolyester, polypropylene, or polyethylene fibers; or combinationsthereof. If the topsheet 338 includes fibers, the fibers may bespunbond, carded, wet-laid, meltblown, hydroentangled, or otherwiseprocessed as is known in the art.

Topsheets 338 may be selected from high loft nonwoven topsheets,apertured film topsheets and apertured nonwoven topsheets. Aperturedfilm topsheets may be pervious to bodily exudates, yet substantiallynon-absorbent, and have a reduced tendency to allow fluids to pass backthrough and rewet the wearer's skin. Exemplary apertured films mayinclude those described in U.S. Pat. Nos. 5,628,097; 5,916,661;6,545,197; and 6,107,539.

As mentioned above, the diaper pant 300 may also include an absorbentassembly 340 that is joined to the chassis 302. As shown in FIG. 14A,the absorbent assembly 340 may have a laterally extending front edge 348in the front waist region 316 and may have a longitudinally opposing andlaterally extending back edge 350 in the back waist region 318. Theabsorbent assembly may have a longitudinally extending right side edge352 and may have a laterally opposing and longitudinally extending leftside edge 354, both absorbent assembly side edges 352 and 354 may extendlongitudinally between the front edge 348 and the back edge 350. Theabsorbent assembly 340 may additionally include one or more absorbentcores 342 or absorbent core layers. The absorbent core 342 may be atleast partially disposed between the topsheet 338 and the backsheet 336and may be formed in various sizes and shapes that are compatible withthe diaper. Exemplary absorbent structures for use as the absorbent coreof the present disclosure are described in U.S. Pat. Nos. 4,610,678;4,673,402; 4,888,231; and 4,834,735.

Some absorbent core embodiments may comprise fluid storage cores thatcontain reduced amounts of cellulosic airfelt material. For instance,such cores may comprise less than about 40%, 30%, 20%, 10%, 5%, or even1% of cellulosic airfelt material. Such a core may comprises primarilyabsorbent gelling material in amounts of at least about 60%, 70%, 80%,85%, 90%, 95%, or even about 100%, where the remainder of the corecomprises a microfiber glue (if applicable). Such cores, microfiberglues, and absorbent gelling materials are described in U.S. Pat. Nos.5,599,335; 5,562,646; 5,669,894; and 6,790,798 as well as U.S. PatentPublication Nos. 2004/0158212 and 2004/0097895.

As previously mentioned, the diaper 300 may also include elasticized legcuffs 356. It is to be appreciated that the leg cuffs 356 can be and aresometimes also referred to as leg bands, side flaps, barrier cuffs,elastic cuffs or gasketing cuffs. The elasticized leg cuffs 356 may beconfigured in various ways to help reduce the leakage of body exudatesin the leg regions. Example leg cuffs 356 may include those described inU.S. Pat. Nos. 3,860,003; 4,909,803; 4,695,278; 4,795,454; 4,704,115;4,909,803; and U.S. Patent Publication No. 2009/0312730A1; and U.S.patent application Ser. No. 13/435,503, entitled “METHODS ANDAPPARATUSES FOR MAKING LEG CUFFS FOR ABSORBENT ARTICLES”, filed on Mar.30, 2012.

As mentioned above, diaper pants may be manufactured with a ring-likeelastic belt 304 and provided to consumers in a configuration whereinthe front waist region 316 and the back waist region 318 are connectedto each other as packaged, prior to being applied to the wearer. Assuch, diaper pants may have a continuous perimeter waist opening 310 andcontinuous perimeter leg openings 312 such as shown in FIG. 13.

As previously mentioned, the ring-like elastic belt 304 is defined by afirst elastic belt 306 connected with a second elastic belt 308. Asshown in FIG. 14A, the first elastic belt 306 defines first and secondopposing end regions 306 a, 306 b and a central region 306 c, and thesecond elastic 308 belt defines first and second opposing end regions308 a, 308 b and a central region 308 c.

The central region 306 c of the first elastic belt is connected with thefirst waist region 316 of the chassis 302, and the central region 308 cof the second elastic belt 308 is connected with the second waist region316 of the chassis 302. As shown in FIG. 13, the first end region 306 aof the first elastic belt 306 is connected with the first end region 308a of the second elastic belt 308 at first side seam 378, and the secondend region 306 b of the first elastic belt 306 is connected with thesecond end region 308 b of the second elastic belt 308 at second sideseam 380 to define the ring-like elastic belt 304 as well as the waistopening 310 and leg openings 312. As discussed in more detail below,bonding apparatuses 100 herein may be used to create discrete bondregions 142 that connect first and second elastic belts 306, 308together at the first and second side seams 378, 380.

As shown in FIGS. 14A, 15A, and 15B, the first elastic belt 306 alsodefines an outer lateral edge 307 a and an inner lateral edge 307 b, andthe second elastic belt 308 defines an outer lateral edge 309 a and aninner lateral edge 309 b. The outer lateral edges 307 a, 307 b may alsodefine the front waist edge 320 and the laterally extending back waistedge 322. The first elastic belt and the second elastic belt may alsoeach include an outer, garment facing layer 362 and an inner, wearerfacing layer 364. It is to be appreciated that the first elastic belt306 and the second elastic belt 308 may comprise the same materialsand/or may have the same structure. In some embodiments, the firstelastic belt 306 and the second elastic belt may comprise differentmaterials and/or may have different structures. It should also beappreciated that the first elastic belt 306 and the second elastic belt308 may be constructed from various materials. For example, the firstand second belts may be manufactured from materials such as plasticfilms; apertured plastic films; woven or nonwoven webs of naturalmaterials (e.g., wood or cotton fibers), synthetic fibers (e.g.,polyolefins, polyamides, polyester, polyethylene, or polypropylenefibers) or a combination of natural and/or synthetic fibers; or coatedwoven or nonwoven webs. In some embodiments, the first and secondelastic belts include a nonwoven web of synthetic fibers, and mayinclude a stretchable nonwoven. In other embodiments, the first andsecond elastic belts include an inner hydrophobic, non-stretchablenonwoven material and an outer hydrophobic, non-stretchable nonwovenmaterial.

The first and second elastic belts 306, 308 may also each include beltelastic material interposed between the outer layer 362 and the innerlayer 364. The belt elastic material may include one or more elasticelements such as strands, ribbons, or panels extending along the lengthsof the elastic belts. As shown in FIGS. 14A, 15A, and 15B, the beltelastic material may include a plurality of elastic strands 368 whichmay be referred to herein as outer, waist elastics 370 and inner, waistelastics 372. As shown in FIG. 14A, the elastic strands 368 continuouslyextend laterally between the first and second opposing end regions 306a, 306 b of the first elastic belt 306 and between the first and secondopposing end regions 308 a, 308 b of the second elastic belt 308. Insome embodiments, some elastic strands 368 may be configured withdiscontinuities in areas, such as for example, where the first andsecond elastic belts 306, 308 overlap the absorbent assembly 340. Insome embodiments, the elastic strands 368 may be disposed at a constantinterval in the longitudinal direction. In other embodiments, theelastic strands 368 may be disposed at different intervals in thelongitudinal direction. The belt elastic material in a stretchedcondition may be interposed and joined between the uncontracted outerlayer and the uncontracted inner layer. When the belt elastic materialis relaxed, the belt elastic material returns to an unstretchedcondition and contracts the outer layer and the inner layer. The beltelastic material may provide a desired variation of contraction force inthe area of the ring-like elastic belt.

It is to be appreciated that the chassis 302 and elastic belts 306, 308may be configured in different ways other than as depicted in FIG. 14A.For example, FIG. 14B shows a plan view of a diaper pant 300 having thesame components as described above with reference to FIG. 14A, exceptthe first laterally extending end edge 344 of the chassis 302 is alignedalong and coincides with the outer lateral edge 307 a of the firstelastic belt 306, and the second laterally extending end edge 346 isaligned along and coincides with the outer lateral edge 309 a of thesecond belt 308.

As previously mentioned, the apparatuses and methods according to thepresent disclosure may be utilized to assemble various components ofdiapers 300. For example, FIG. 16 shows a schematic view of a convertingapparatus 500 adapted to manufacture pant diapers 300. The method ofoperation of the converting apparatus 500 may be described withreference to the various components of pant diapers 300 described aboveand shown in FIGS. 13 and 14A. Although the following methods areprovided in the context of the diaper 300 shown in FIGS. 13 and 14A, itis to be appreciated that various embodiments of diaper pants can bemanufactured according to the methods disclosed herein, such as forexample, the absorbent articles disclosed in U.S. Pat. No. 7,569,039and; U.S. Patent Publication Nos. 2005/0107764A1, US2012/0061016A1, andUS2012/0061015A1, which are all hereby incorporated by reference herein.

As described in more detail below, the converting apparatus 500 shown inFIG. 16 operates to advance discrete chassis 302 along a machinedirection MD such that the lateral axis of each chassis 302 is parallelwith the machine direction, and wherein the chassis 302 are spaced apartfrom each other along the machine direction. Opposing waist regions 316,318 of the spaced apart chassis 302 are then connected with continuouslengths of advancing first and second elastic belt substrates 606, 608.The chassis 302 are then folded along the lateral axis to bring thefirst and second elastic belt substrates 606, 608 into a facingrelationship, and the first and second elastic belt substrates areconnected together along regions 536 intermittently spaced along themachine direction, wherein each region 536 may include one or morediscrete bond sites 142. And the elastic belt substrates 606, 608 arecut along the regions 536 to create discrete diapers 300, such as shownin FIG. 13.

As shown in FIGS. 16 and 15A, a continuous length of chassis assemblies502 are advanced in a machine direction MD to a carrier apparatus 508and cut into discrete chassis 302 with knife roll 506. The continuouslength of chassis assemblies may include absorbent assemblies 340sandwiched between topsheet material 338 and backsheet material 336, legelastics, barrier leg cuffs and the like. A portion of the chassisassembly is cut-away to show a portion of the topsheet material 338 andan absorbent assembly 340.

After the discrete absorbent chassis 302 are cut by the knife roll 506,the carrier apparatus 508 rotates and advances the discrete chassis 302in the machine direction MD in the orientation shown in FIG. 17B1,wherein the longitudinal axis 324 of the chassis 302 is generallyparallel with the machine direction MD. While the chassis 302 shown inFIG. 17B1 is shown with the second laterally extending end edge 346 as aleading edge and the first laterally extending end edge 344 as thetrailing edge, it is to be appreciated that in other embodiments, thechassis 302 may be advanced in other orientations. For example, thechassis may be oriented such that the second laterally extending endedge 346 is a trailing edge and the first laterally extending end edge344 is a leading edge. The carrier apparatus 508 also rotates while atthe same time changing the orientation of the advancing chassis 302. Thecarrier apparatus 508 may also change the speed at which the chassis 302advances in the machine direction MD. It is to be appreciated thatvarious forms of carrier apparatuses may be used with the methodsherein, such as for example, the carrier apparatuses disclosed in U.S.Pat. No. 7,587,966. FIG. 17B2 shows the orientation of the chassis 302on the carrier apparatus 508 while advancing in the machine direction.More particularly, FIG. 17B2 shows the chassis 302 with the lateral axis326 of the chassis 302 generally parallel with the machine direction MD,and wherein the second longitudinal side edge 330 is the leading edgeand the first longitudinal side edge 328 is the trailing edge.

As discussed below with reference to FIGS. 16, 17C, 17D, 17E, and 17F,the chassis 302 are transferred from the carrier apparatus 508 andcombined with advancing, continuous lengths of belt substrates 606, 608,which are subsequently cut to form first and second elastic belts 306,308 on diapers 300.

With reference to FIGS. 15 and 17C, the chassis 302 are transferred fromthe carrier apparatus 508 to a nip 516 between the carrier apparatus 508and a carrier apparatus 518 where the chassis 302 is combined withcontinuous lengths of advancing front belt 606 and back belt 608substrate material. The front belt substrate material 606 and the backbelt substrate material 608 each define a wearer facing surface 512 andan opposing garment facing surface 514. The wearer facing surface 512 ofthe first belt substrate 606 may be combined with the garment facingsurface 334 of the chassis 302 along the first waist region 316, and thewearer facing surface 512 of the second belt substrate 608 may becombined with the garment facing surface 334 of the chassis 302 alongthe second waist region 318. As shown in FIG. 16, adhesive 520 may beintermittently applied to the wearer facing surface 512 of the first andsecond belt substrates 606, 608 before combining with the discretechassis 302 at the nip 516 between roll 518 and the carrier apparatus508.

With reference to FIGS. 16 and 17D, a continuous length of absorbentarticles 600 are defined by multiple discrete chassis 302 spaced fromeach other along the machine direction MD and connected with each otherby the second belt substrate 608 and the first belt substrate 606. Asshown in FIG. 16, the continuous length of absorbent articles 600advances from the nip 516 to a folding apparatus 500. At the foldingapparatus 500, each chassis 302 is folded in the cross direction CDalong a lateral axis 326 to place the first waist region 316, andspecifically, the inner, body facing surface 332 into a facing, surfaceto surface orientation with the inner, body surface 332 of the secondwaist region 318. The folding of the chassis also positions the wearerfacing surface 512 of the second belt substrate 608 extending betweeneach chassis 302 in a facing relationship with the wearer facing surface512 of the first belt substrate 606 extending between each chassis 302.As shown in FIGS. 16, 17D, and 17E, the folded discrete chassis 302connected with the first and second belt substrates 606, 608 areadvanced from the folding apparatus 500 to a bonder apparatus 100, suchas described above. The bonder apparatus 100 operates to bond an overlaparea 362, thus creating discrete bond sites 142. The overlap area 362includes a portion of the second belt substrate 608 extending betweeneach chassis 302 and a portion of the first belt substrate 606 extendingbetween each chassis 302. As shown in FIGS. 16 and 17F, a continuouslength of absorbent articles are advanced from the bonder 100 to a kniferoll 538 where the regions 536 are cut into along the cross direction tocreate a first side seam 378 on an absorbent article 300 and a secondside seam 380 on a subsequently advancing absorbent article.

Although the absorbent article is described as having a first and secondbelt substrate, it is to be appreciated that the absorbent article mayhave only one belt substrate. Further, it is to be appreciated that thechassis and belt substrate of the absorbent article may be onecontinuous substrate such that the overlap area is formed from the samesubstrate. As such, the bonder apparatus may operate to bond acontinuous substrate at an overlap area to form one or more discretebond sites.

Although the apparatuses and methods have been described in the contextof the diapers 300 shown in FIGS. 13, 14A, and 14B, it is to beappreciated that the methods and apparatuses herein may be used toassemble and bond various substrates and/or elastic laminates that canbe used with various process configurations and/or absorbent articles,such as for example, disclosed in U.S. Pat. No. 7,569,039; U.S. PatentPublication Nos. US2005/0107764A1, US2012/0061016A1, andUS2012/0061015A1; U.S. patent application Ser. No. 13/434,984, filed onMar. 30, 2012; U.S. patent application Ser. No. 13/435,036, filed onMar. 30, 2012; U.S. patent application Ser. No. 13/435,063, filed onMar. 30, 2012; U.S. patent application Ser. No. 13/435,247, filed onMar. 30, 2012; and U.S. patent application Ser. No. 13/435,503, filed onMar. 30, 2012, all of which are incorporated by reference herein. Forexample, the bonding apparatuses and methods herein can be used to applytack-down bonds on leg cuffs, such as described in U.S. patentapplication Ser. No. 13/435,503, entitled “METHODS AND APPARATUSES FORMAKING LEG CUFFS FOR ABSORBENT ARTICLES”, filed on Mar. 30, 2012.

In the context of the previous discussion, the apparatuses 100 andmethods herein may be used to provide for the application of bonds 142in patterns to substrates and components during the manufacture of anabsorbent article. For example, bonds 142 may be applied in variouspatterns to portions of any of the topsheet, backsheet, absorbent core,leg cuffs, waist feature, ears, and fastening elements during themanufacture of an absorbent article. In some instances, the adhesive maybe used in combination with the bonding methods herein.

Peel Strength Test Method

Bond Strength is measured using a 180° T-peel test on a constant rate ofextension tensile tester with computer interface (a suitable instrumentis the MTS Model Q-Test/1 using Testworks 4.0 Software, as availablefrom MTS Systems Corp., Eden Prairie, Minn.) using a load cell for whichthe forces measured are within 10% to 90% of the limit of the cell. Boththe movable (upper) and stationary (lower) pneumatic jaws are fittedwith smooth stainless steel faced grips, 25.4 mm in height and widerthan the width of the test specimen. Air pressure supplied to the jawsis sufficient to prevent sample slippage. All testing is performed in aconditioned room maintained at about 23° C.±2 C.° and about 50° C.±2 C.°relative humidity.

Condition the samples at 23±2° C. and 50%±2% relative humidity for atleast 24 hours prior to testing. Identify the bond site to be tested.The test specimen consists of the bond and the two material layers whichare bonded together. Using a razor knife or scissors cut the specimen25.4 mm±0.1 mm in the dimension parallel to the bond, and preferably50.8 mm in the dimension perpendicular to and centered on the bond. If a50.8 mm perpendicular length cannot be harvested from the article,attach leads made from adhesive tape (e.g., duct tape) to the specimenfor use to secure it in the tensile tester's grip faces.

Program the tensile tester to perform an extension test, collectingforce and extension data at an acquisition rate of 50 Hz as thecrosshead raises at a rate of 304 mm/min until the two layers areseparated.

Set the gage length to 25.4 mm±0.1 mm and zero the crosshead position.Referring to FIG. 20, position the end of the first layer (or attachedleader) 702 within the upper grip faces. Align the specimen 700vertically with the bond site 703 centered between the upper and lowergrip faces and close the upper grip faces. With the specimen hangingdownward and not touching the bottom fixture, zero the load cell.Position the second layer (or attached leader) 704 within the lower gripfaces and close. The specimen should be under enough tension toeliminate any slack, but less than 0.05 N of force on the load cell.

Start the test and collect data. From the resulting Force (N) versusExtension (mm) curve, calculate the Maximum Peak Force (N). Calculatethe Bond Strength (N/m) as the Peak Force (N) divided by the specimenwidth (m) and record to the nearest 0.1 N/m.

Repeat the test on a total of ten substantially identical articlesselecting the corresponding test site on each article. Report theaverage Bond Strength (N/m) to the nearest 0.1 N/m.

End of Peel Strength Test Method

This application is a divisional of U.S. patent application Ser. No.14/301,426, filed on Jun. 11, 2014, which claims the benefit of U.S.Provisional Application No. 61/836,690, filed Jun. 19, 2013, theentireties of which are both incorporated by reference herein.

The dimensions and values disclosed herein are not to be understood asbeing strictly limited to the exact numerical values recited. Instead,unless otherwise specified, each such dimension is intended to mean boththe recited value and a functionally equivalent range surrounding thatvalue. For example, a dimension disclosed as “40 mm” is intended to mean“about 40 mm.”

Every document cited herein, including any cross referenced or relatedpatent or application, is hereby incorporated herein by reference in itsentirety unless expressly excluded or otherwise limited. The citation ofany document is not an admission that it is prior art with respect toany invention disclosed or claimed herein or that it alone, or in anycombination with any other reference or references, teaches, suggests ordiscloses any such invention. Further, to the extent that any meaning ordefinition of a term in this document conflicts with any meaning ordefinition of the same term in a document incorporated by reference, themeaning or definition assigned to that term in this document shallgovern.

While particular embodiments of the present invention have beenillustrated and described, it would be obvious to those skilled in theart that various other changes and modifications can be made withoutdeparting from the spirit and scope of the invention. It is thereforeintended to cover in the appended claims all such changes andmodifications that are within the scope of this invention.

What is claimed is:
 1. An apparatus for dynamically bonding substrates,the apparatus comprising: an anvil roll; a bonding roll including: abase circumferential surface; a pattern element, wherein the patternelement includes a first pattern surface, a second pattern surface, athird pattern surface, and a fourth pattern surface, and wherein thepattern element protrudes outward from the base circumferential surfaceto define a distance, Hp, between the first, second, third, and fourthpattern surfaces and the base circumferential surface, and wherein thepattern element is bounded by a perimeter; a first channel in thepattern element, the first channel having a first end portion and asecond end portion, the first end portion located on the perimeter; asecond channel in the pattern element, the second channel having a firstend portion and a second end portion, the first end portion and thesecond end portion located on the perimeter, wherein the first channeland the second channel cross each other and separate the first, second,third, and fourth pattern surfaces from each other; and wherein thebonding roll is adjacent the anvil roll to define a nip between thefirst, second, third, and fourth pattern surfaces and the anvil roll;and wherein the bonding roll is biased toward the anvil roll to define anip pressure from about 40,000 PSI to about 60,000 PSI between thefirst, second, third, and fourth pattern surfaces and the anvil roll. 2.The apparatus of claim 1, wherein the second end portion of the firstchannel is located on the perimeter.
 3. The apparatus of claim 1,wherein the perimeter defines an elliptical shape.